12英寸全系列設(shè)備重磅亮相
 

經(jīng)過十三年來的技術(shù)沉淀與創(chuàng)新突破，山東力冠精準(zhǔn)把握行業(yè)發(fā)展趨勢(shì)，經(jīng)過1000多個(gè)日夜持續(xù)的技術(shù)攻堅(jiān)，10000多個(gè)小時(shí)的測(cè)試驗(yàn)證，最終攻克大尺寸設(shè)備核心技術(shù)瓶頸，全面覆蓋集成電路、先進(jìn)封裝等核心應(yīng)用領(lǐng)域，適配多種材料，可滿足多樣化工藝需求。

· 12英寸氧化/合金/退火設(shè)備：

適用于氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)等工藝。

· 12英寸LPCVD設(shè)備：

適用于氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、二氧化硅(TEOS)、HTO等工藝。

· 12英寸ALD設(shè)備：

適用于氮化硅(SiN)、二氧化硅(SiO2)等膜層的沉積。

作為山東省“專精特新中小企業(yè)”“瞪羚企業(yè)”，山東力冠憑借扎實(shí)的技術(shù)積累，已斬獲多項(xiàng)行業(yè)榮譽(yù)，產(chǎn)品不僅覆蓋國(guó)內(nèi)市場(chǎng)，更出口中國(guó)臺(tái)灣、新加坡、歐美等國(guó)家，獲得全球客戶的認(rèn)可。

未來，山東力冠將持續(xù)深耕半導(dǎo)體裝備領(lǐng)域，不斷推進(jìn)技術(shù)迭代與產(chǎn)品升級(jí)，在鞏固12英寸爐管設(shè)備全覆蓋優(yōu)勢(shì)的基礎(chǔ)上，積極向更高工藝制程、更先進(jìn)半導(dǎo)體裝備研發(fā)進(jìn)軍，助力中國(guó)半導(dǎo)體產(chǎn)業(yè)突破瓶頸、實(shí)現(xiàn)高質(zhì)量發(fā)展，朝著成為世界級(jí)半導(dǎo)體行業(yè)領(lǐng)導(dǎo)者的目標(biāo)不斷邁進(jìn)。

Liguan Breakthrough: Shandong liguan Empowers Semiconductor Upgrade, Conquering the Large-Size Equipment Peak.

Shandong Liguan Embarks on a New Journey! Recently, Shandong Liguan Microelectronic Equipment Co., Ltd. has successfully expanded into the 12-inch semiconductor core equipment sector, launching a full series of 12-inch equipment for Oxidation/Alloy/Annealing/LPCVD/ALD processes. 

Since its inception in 2013, the company began with 4-inch vertical furnace systems and has steadily advanced, achieving independent R&D and iterative upgrades for 6-inch and 8-inch tools. Now, with full-series coverage of 12-inch vertical furnace equipment, Shandong Liguan has established itself as a key player in the domestic large-wafer semiconductor equipment landscape, providing robust support for China's pursuit of self-sufficiency and control over its semiconductor supply chain.

Focusing on the Core Track: 12-Inch Full-Series Equipment Makes a Grand Debut
After 13 years of technological accumulation and innovation breakthroughs, Shandong Liguan has precisely grasped industry development trends. Through over 1,000 days and nights of continuous technical and more than 10,000 hours of testing and validation, the company has finally overcome the core technical bottlenecks of large-size equipment. Its products now comprehensively cover core application areas such as integrated circuits and advanced packaging, are compatible with various materials, and can meet diverse process requirements.

Highlights of Core Equipment

• 12-Inch Oxidation/Alloy/Annealing Equipment: Suitable for processes such as Oxidation, Annealing, Polyimide curing, and Alloy.

• 12-Inch LPCVD Equipment: Suitable for processes involving Silicon Nitride (SiN), Polysilicon (Poly-Si/U-Poly/D-Poly), Silicon Dioxide (TEOS), HTO, etc.

• 12-Inch ALD Equipment: Suitable for depositing film layers such as Silicon Nitride (SiN) and Silicon Dioxide (SiO2).